Tous les produits
Personne à contacter :
Zhang
Numéro de téléphone :
13906180575
Wave Soldering Transparent Liquid Flux Highly Active For Electronics Foaming Spraying
| Lieu d'origine | La Chine |
|---|---|
| Nom de marque | Wuxi Top Chemical |
| Certification | ISO9001 |
| Numéro de modèle | THC11 |
| Quantité de commande min | 10 tonnes |
| Prix | Call/negotiable |
| Détails d'emballage | 1 conteneur |
| Délai de livraison | 5-8 jours |
| Conditions de paiement | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
| Capacité d'approvisionnement | 500 tonnes/mois |
Contactez-moi pour des échantillons gratuits et des coupons.
WhatsApp:0086 18588475571
Le WECHAT: 0086 18588475571
Skype est là.: sales10@aixton.com
Si vous avez n'importe quel souci, nous fournissons l'aide en ligne de 24 heures.
xDétails sur le produit
| Aspect | liquide jaune-clair, clair et transparent | Odeur | dissolvant organique |
|---|---|---|---|
| Contenu solide (w/w) | 12.0±0.5 | valeur de p H | acide faible |
| Densité (g/ml) | 0.810±0.008 | Corrosif | aucune pénétration corrosive |
| Temps d'entreposage | 12 mois | Avantages | NO--nettoyage |
| Surligner | clear transparent liquid rosin flux,liquid rosin flux organic solvent,liquid solder for electronics Highly active |
||
Description de produit
Light yellow transparent liquid Highly active flux for foaming and spraying
1. Introduction
THC11 flux is a flux with high solid content (12% solid content) and higher activity. It can be used in foaming, spraying and other forms.The resin active system has excellent wettability on the surface of bare copper and solder layer.The welding of multi-layer boards with metallized small holes will show excellent penetration performance.
2. Features and advantages
△ Some special activators added to THC11 flux are used to reduce the surface tension between the solder mask and the solder, which greatly reduces the generation of solder balls.
△ The heat-stable activator in the high-solid no-clean flux reduces the incidence of continuous soldering defects in wave soldering and selective soldering.
3. Instructions for use
△ In order to meet the requirements of stable welding performance and electrical performance reliability, the process establishment related to circuit boards and components must meet the requirements of weldability and ion clarity. It is recommended that the assembler put forward relevant regulations on the suppliers of related materials and require the incoming material analysis certificate or the assembler to carry out incoming material inspection.
△ The circuit board should be handled carefully during the assembly process, and only the edges of the circuit board should be grasped. It is recommended to use clean, lint-free gloves.
△ Use FD5050 thinner to regularly clean the conveyor belt, chain teeth and fixtures to avoid the increase of residues on the edge of the circuit board after assembly.
4.Safe disposal and storage methods:
| * Store in a cool, dry, well-ventilated place or a dangerous goods warehouse that cannot be directly exposed to sunlight. * The work area should have a "No Pyrotechnics" sign. * The storage area should be clearly marked, and designated or trained personnel are allowed to enter. * Empty barrels and pipelines may still have residues, and heat treatment has to be carried out before cleaning. |
5. Hazard identification data
| Cause of defect | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 |
| Missing | √ | √ | √ | |||||||
| Duoxi Webbing | √ | √ | √ | √ | √ | |||||
| Tin Cave Viods | √ | |||||||||
| Pingoles | √ | √ | ||||||||
| Lcicles | √ | √ | √ | √ | √ | √ | √ | |||
| Coarse tin Graing | √ | |||||||||
| Bridging | √ | √ | √ | √ | ||||||
| Balling | √ | √ | √ | √ | √ | |||||
| Short circuit Shorts | √ | √ | √ |
Note: √ means possible cause 1. Poor contact between the flux and the bottom plate; improper contact angle of the bottom plate solder 2. The specific gravity of the flux is too high or too low 3. The speed of the conveyor belt is too fast or too slow. Glossy; if it is too slow, it will be slightly round and thick. 4. Too much anti-oxidation oil or deterioration in the tin furnace. 5. The preheating temperature is too high or too low. 6. The temperature of the tin furnace is too high or too low. And short and thick, too low to be thin and sharp and shiny 7. The solder furnace wave crest is unstable 8. The solder in the tin furnace contains impurities 9. The component wiring direction and arrangement are poor. 10. The original board lead is improperly handled.
6.Solder Liquid Flux picture
produits recommandés